Given this diversity of materials and processes, our adaptable and scalable approach is to fabricate devices separately, through internal or external sources, followed by 2.5D integration of these devices onto high-density interposers.  This approach allows access to a variety of technologies and components but is complicated by the dominance of the pure-play foundry model, prohibitive cost of full wafer runs, limited supplier options for given technologies, and small product quantities with limited learning cycles.  To address some of these issues, we have been exploring single-die processing of underbump metals, interposers with solder and metal pillars for flip-chip integration, and other approaches targeting these technology sets.

This presentation will start with an overview of Sandia, followed by a summary of Sandia’s Microsystems capability and early-stage research activities in next-generation microsystem device technologies.  Finally, the presentation will focus on RF miniaturization technology developments and a vision for an adaptable and scalable 2.5D approach for heterogeneous integration within practical limits of technology access, development costs, and turn-time. 

SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525.