ECE 59500 - Reliability Physics of Advanced Packaging

Course Details

Lecture Hours: 1 Credits: 1

Areas of Specialization:

  • Microelectronics and Nanotechnology

Counts as:

  • EE Elective
  • CMPE Selective - Special Content

Experimental Course Offered:

Spring 2025

Campus/Online:

On-campus and online

Requisites:

CHM 11500 and ((MA 26500 and MA 26600) or MA 26200) and PHYS 17200

Requisites by Topic:

Introductory chemistry, linear algebra, differential equations and introductory physics

Catalog Description:

The future of Microelectronics depends on the 3D integration of Integrated Circuits, powered by advanced packaging technology. While the design principles of advanced packaging are well-established, their reliability in different applications (e.g., data center, automotive, edge AI) remains a challenge for system integrators like Apple, Tesla, Nvidia, and AMD. This course will demystify these challenges and empower students with valuable skills and knowledge, making them sought-after engineers in the industry.

Required Text(s):

None.

Recommended Text(s):

None.

Learning Outcomes

A student who successfully fulfills the course requirements will have demonstrated:

  • an understanding of the application-specific choice of packaging technology
  • an understanding of the reliability issues related to chip-package interaction
  • an ability to calculate the key parameters of interest with simple intuitive understanding of the key principles

Lecture Outline:

Lectures Lecture Topics
1 Introduction to Advanced Packaging: Packaging Evolution; 2.5D Interposer process and materials; 3D system integration; Fan-out WL packaging; Embedded Packaging; Principle of material selection.
2 Electrical Reliability Challenges in Advanced Packaging: Electro-thermal cross-talk among transistors, memory, inductors and capacitors; Theory of dialectric breakdown in thin and thick oxides; Application of dielectric breakdown i gate oxides, BEOL oxides, TSV oxides, RTL oxides/polymers, mold-compound breakdown; Physics of electrochemical corrosion failure; Accelerated test methodologies and burn-in tests
3 Mechanical Reliability Challenges in Advanced Packaging: Thermal-induced mechanical stress; Moisture-induced delamination during solder reflow and self-heating; Backend reliability concerns; Reliability concerns for interposers; Reliability concerns solder/vertical interconnections; Impact of various material selections

Assessment Method:

Exams, quizzes and homework