ECE 69500 - Nanometer Scale Patterning and Processing

Note:

Midterm exam: 30% Problems-of-the-week: 10% (+ bonus points) Key Technical Paper Search (individual): 30% Technology Intelligence Case Study (group): 30% (Students vote for topics, and will be grouped with their interests and backgrounds).

Course Details

Lecture Hours: 3 Credits: 3

Counts as:

Experimental Course Offered:

Spring 2010, Spring 2012, Spring 2014

Catalog Description:

Top-down approach to the fabrication of nanometer-scale (<100nm) structures. Principles of lithography, film deposition, reactive-ion etch and planarization. Survey of state-of-the-art nanofabrication techniques.

Required Text(s):

None.

Recommended Text(s):

  1. Submicron and Nanometer Technology , Henry I. Smith , NanoStructures Press

Lecture Outline:

Week Major Topics
1 Introduction to nanometer-structures technology and applications; top-down approach and bottom-up approach; Contamination control (classes of cleanrooms, etc.), Substrate cleaning
2 Adding materials for nanofabrication: spin-coating, evaporation (including lift-off), Chemical Vapor Deposition (CVD); Resist technology.
3 Fourier optics and optical microscopy; Optical resolution. Spatial filtering and contrast in optical microscopy;
4 Optical systems for lithography: contact and near-field optical lithography, projection optical lithography; Laser interferometer technology.
5 Resolution enhancement techniques; Negative refraction and superlens effect.
6 Laser interference lithography and its application to periodic nanostructures, including negative index metamaterials and photonic crystals. Surface profilometer and Atomic Force Microscopy (AFM); Ellipsometry.
7 Electro-optical systems for microscopy and lithography; Signals and noise in scanning-electron-beam systems.
8 Electron-beam lithography systems; Electron scattering and proximity effects
9 Introduction to the Vector Beam system in Birck Nanotechnology Center (including video and/or site visit).
10 Focused ion-beam lithography; Mask making; Maskless lithography.
11 Proximity x-ray lithography, electron and ion projection lithography, focused ion-beam lithography, proximal-probe lithography; embossing; Resolution, throughput and cost of future lithography tools.
12 Nanoimprint Lithography: thermal and step-and-flash. Soft-lithography. Registration and overlay techniques in lithography.
13 Removing materials: plasma basics, (deep) reactive-ion etch, sputter etch, ion-milling; Wet etch; polishing and planarization.
14 More ways of adding materials: sputter deposition, electroplating, Atomic Layer Deposition (ALD) and epitaxy (lattice mismatch, critical thickness).
15 Technology Intelligence Case Study Presentations

Assessment Method:

none