Proto-TAI++: Exploring Perceptually Consistent Creation of Planar Shape Assemblies Through Multimodal Tangible Interactions

by | Jul 20, 2016

Authors: Cecil Piya, Vinayak, Karthik Ramani
Journal of Computing and Information Science in Engineering, Volume 16, Issue 3, September 2016
https://doi.org/10.1115/1.4034266

We explore tangible 3D interactions that allow for geometric and perceptual correspondence between a midair modality and the 3D elements it controls. To demonstrate our approach, we use a concrete application scenario through Proto-TAI++, a multimodal system using pen-based drawing of planar shapes and their subsequent midair assembly via a hand-held planar proxy. The planarity of the proxy is a key element that physically embodies virtual planar shapes during 3D manipulation. We also investigate advanced operations such as patterning and blending using asymmetric bimanual interactions that augment midair motion with multitouch gestures. We describe a three-stage user evaluation with our system wherein our goal is to (a) study the effectiveness of the planar proxy as a tangible 3D modality, (b) contrast key features of our approach with a GUI-based planar shape assembly system, and (c) evaluate user experience and performance in creative tasks using Proto-TAI++.

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Cecil Piya is a PhD graduate from the school of Mechanical Engineering at Purdue University. Dr. Piya received his BSc in mechanical engineering from Worcester Polytechnic Institute, and earned his Doctorate at Purdue, while working as a graduate researcher in the C-Design Lab under Prof. Karthik Ramani. Here, his research explored novel Human-Computer Interactions and Digital Interfaces that leverage spatial gestures, tangible interactions, and pen-and-touch based media to support virtual 3D product design and shape modeling. In the past he also conducted research in areas such as digital shape reconstruction from 3D point clouds, geometric support for additive manufacturing, feature detection in 3D models, object identification in 2D images, and heat transfer.